Bench Talk

(Source: Diodes Incorporated)

Right now, the automotive industry is going through a big transformation as it rapidly shifts from internal combustion engines to battery-powered electric vehicles (EVs). Governments around the world are passing ever-stricter environmental regulations and requiring lower emissions, with EVs providing the only way to hit these targets.

This shift is creating new demands for power electronics in the automotive sector, including charging systems, engine management systems, converters, and motor drivers. Across all these applications, designers demand better efficiency from power components. By minimizing losses, they can improve the range of the vehicle, which is a vital differentiator for car buyers. Better efficiency also reduces the heat dissipated by components, thus enabling more compact designs and reducing thermal problems such as decreased reliability.

As well as efficiency, engineers are also looking for compact components with a small footprint, helping them to create high-power-density designs. Additionally, any devices used in vehicles need to be able to work reliably in harsh conditions and must be qualified to the appropriate automotive standards.

Efficiency for the Future

To help meet these automotive requirements, Diodes Incorporated has introduced the DMTH4M70SPGWQ a 40V Automotive Complaint MOSFET packaged in the PowerDI®8080-5 package, an innovative high current thermally efficient power package that meets the needs of EV applications. The DMTH4M70SPGWQ features a typical R_DS(ON) of just 0.54mΩ at a gate drive of 10V, which coupled with its low gate charge of 117nC enables it to minimize power losses enabling high density designs high-power BLDC motor drivers, high-power DC-DC converters, power steering, and charging systems.

The MOSFET is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities. It is rated to +175°C, making it ideal for high ambient temperature environments. Its gull-wing leads facilitate automated optical inspection (AOI) and improve high-temperature cycling reliability.

Furthermore, it has a PCB footprint of just 64mm², which is 40% less than that of the TO263 (D2PAK) package format. It also has an off-board profile of 1.7mm, which is 63% lower than that of a TO263.

The copper clip bonding between the die and the terminals enables a low junction-to-case thermal resistance of 0.36°C/W. This allows the PowerDI 8080-5 package to handle drain currents up to 460A and deliver a power density that is eight times greater than a TO263 package. The clip design also reduces parasitic inductance and improves electromagnetic interference (EMI) performance.

Conclusion

The push to EVs is reshaping the automotive industry in significant ways, especially in terms of power electronics. As the automotive industry rapidly shifts towards its EV future, the AEC-Q101 qualified, PPAP capable DMTH4M70SPGWQ 40V MOSFET in the PowerDI 8080-5 package enables the high-power-density designs that deliver the greatest efficiency for battery-powered vehicles. With a low R_DS(ON) of 0.54mΩ at a gate drive of 10V, the DMTH4M70SPGWQ 40V MOSFET minimizes power losses and maximizes system efficiency while minimizing power dissipation and switching losses.

Author

Ian Moulding, Discrete Marketing Manager, Automotive Business Unit, Diodes Incorporated.
Ian Moulding, a seasoned professional with over 20 years of experience in the semiconductor industry, currently serves as the Global Automotive Marketing Manager at Diodes Incorporated. He leads a dynamic team of product marketing and applications engineers, driving them towards achieving their annual commercial and technical objectives.

The 40V MOSFET Delivers Efficiency Gains for Electric Vehicles blog was first published on www.diodes.com and is republished here with permission.